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The purpose of this paper is to investigate the thermomechanical response of four well-known lead-free die attach materials: sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds.

This examination is conducted through finite element analysis. The mechanical properties of all die attach systems, including elastic and Anand creep parameters, are obtained from relevant literature and incorporated into the numerical analysis. Consequently, the bond stress-strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results indicate that silver-tin TLP bonds are prone to exhibiting higher inelastic strain energy densities, while sintered silver and copper interconnects tend to possess higher levels of plastic strains and deformations. This suggests a higher susceptibility to damage in these metallic die attachments. On the other hand, the more expensive gold-based solders exhibit lower inelastic strain energy densities and plastic strains, implying an improved fatigue performance compared to other bonding configurations.

The utilization of different metallic material systems as die attachments in power electronics necessitates a comprehensive understanding of their thermomechanical behavior. Therefore, the results of the present paper can be useful in the die attach material selection in power electronics.

In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis.

During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations.

This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.

This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

In literature, there is no constitutive modeling data on the AgSn TLP bonds.

The continuous increase of energy demands is a critical worldwide matter. Jordan’s household sector accounts for 44% of overall electricity usage annually. This study aims to use artificial neural networks (ANNs) to assess and forecast electricity usage and demands in Jordan’s residential sector.

Four parameters are evaluated throughout the analysis, namely, population (P), income level (IL), electricity unit price (E$) and fuel unit price (F$). Data on electricity usage and independent factors are gathered from government and literature sources from 1985 to 2020. Several networks are analyzed and optimized for the ANN in terms of root mean square error, mean absolute percentage error and coefficient of determination (R²).

The predictions of this model are validated and compared with literature-reported models. The results of this investigation showed that the electricity demand of the Jordanian household sector is mainly driven by the population and the fuel price. Finally, time series analysis approach is incorporated to forecast the electricity demands in Jordan’s residential sector for the next decade.

The paper provides useful recommendations and suggestions for the decision-makers in the country for dynamic planning for future resource policies in the household sector.

Financial technology (fintech) has emerged as a major player in the global financial system, providing a range of services such as payments, digital currencies, money transfers, loans, crowdsourcing, and insurance. Fintech startups in Arab countries have also gained traction due to economic openness and globalization. However, concerns remain about the safety, durability, and security of traditional financial services, especially with the increasing use of artificial intelligence (AI) and digitization. The Central Bank of Bahrain and other regulatory authorities need to balance risk avoidance with the global trend toward innovation in fintech, as well as ensure that these technologies are not used for fraud, money laundering, piracy, or terrorist financing. The Bahraini government and supervisory authorities must strike a balance between preserving the integrity and robustness of the financial and banking sector and developing innovation. This can be achieved by adjusting the rhythm of comparison, strengthening and enhancing the safety of banks, achieving financial stability, and ensuring compliance with laws and legislation. It is important to address gaps in regulatory rules, information security, and the business environment, and launch financial awareness at the community level before embracing the potential of fintech and its unseen future development at the level of cryptocurrencies and others. The current work examines the impact of Fintech on the Future of banking in Bahrain and the opportunities and challenges.