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1 – 1 of 1Michal Baszynski, Edward Ramotowski, Dariusz Ostaszewski, Tomasz Klej, Mariusz Wojcik, Mikko Kohvakka and Anssi Kamari
– The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies.
Abstract
Purpose
The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies.
Design/methodology/approach
Four PCBs with the same layout but made with use of different materials and technologies have been investigated using thermal camera to compare their thermal properties.
Findings
The results show how important the thermal properties of PCBs are for providing effective heat dissipation, and how a simple alteration to the design can help to improve the thermal performance of electronic device. Proper layout, new materials and technologies of PCB manufacturing can significantly reduce the temperature of electronic components resulting in higher reliability of electronic and power electronic devices.
Originality/value
This paper shows the advantages of new technologies and materials in PCB thermal management.
Details