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This paper aims to investigate the bonding of the photonic integrated circuit (PIC) chip with the heat sink using the AlNi self-propagating soldering method.

Compared to industrial optical modules, optical modules for aerospace applications require better reliability and stability, which is hard to achieve via the dispensing adhesive process that is used for traditional industrial optical modules. In this paper, 25 µm SAC305 solder foils and the AlNi nanofoil heat source were used to bond the back of the PIC chip with the heat sink. The temperature field and temperature history were analyzed by the finite element analysis (FEA) method. The junction-to-case thermal resistance is 0.0353°C/W and reduced by 85% compared with the UV hybrid epoxy joint.

The self-propagating reaction ends within 2.82 ms. The maximum temperature in the PIC operating area during the process is 368.5°C. The maximum heating and cooling rates of the solder were 1.39 × 107°C/s and −5.15 × 106°C/s, respectively. The microstructure of SAC305 under self-propagating reaction heating is more refined than the microstructure of SAC305 under reflow. The porosity of the heat sink-SAC305-PIC chip self-propagating joint is only 4.7%. Several metastable phases appear as AuSn3.4 and AgSn3.

A new bonding technology was used to form the bonding between the PIC chip with the heat sink for the aerospace optical module. The reliability and thermal resistance of the joint are better than that of the UV hybrid epoxy joint.

The conflicting results on the corrosion characteristics of aluminium matrix composites reinforced with agrarian waste have stimulated an investigation on the hardness and corrosion rate of sugar palm fibre ash (SPFA) reinforced LM26 Al/alloy composite by varying the SPFA from 0 to 10 wt% in an interval of 2 wt%. This paper aims to discuss the aforementioned issue.

The composites were produced via stir-casting and the hardness was determined using a Vickers hardness testing machine, corrosion rate was examined through the weight loss method by immersion in 0.5, 1.0 and 1.5 M hydrochloric acid (HCl) at temperatures of 303, 318, and 333 K for the maximum duration of 120 h. The morphological study was conducted using a scanning electron microscope (SEM) on the samples before and after immersion in HCl.

The incorporation of SPFA improved the hardness of the alloy from 58.22 to 93.62 VH after 10 wt% addition. The corrosion rate increases with increased content of SPFA, the concentration of HCl and temperature. The least corrosion rate of 0.0272 mpy was observed for the LM26 Al alloy in 0.5 M after 24 h while the highest corrosion rate of 0.8511 mpy was recorded for LM26 Al/10 wt% SPFA in 1.5 M HCl acid after 120 h. The SEM image of corroded samples revealed an increased number of pits with increased SPFA content.

The work is limited to SPFA up to 10 wt% as reinforcement in LM26 Al alloy, the use of HCl as corrosion medium, temperatures in the range of 303–333 K, and a weight loss method were used to evaluate the corrosion rate.

The corrosion rate was determined for LM26 Al/SPFA composites with various amounts of SPFA in 0.5, 1.0 and 1.5 M HCl at 303, 318 and 333 K and compared with the matrix alloy.