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This paper discusses the microstructures of solder joints and the mechanism of thermal fatigue, which is an important source of failure in electronic devices. The solder joints studied were near‐eutectic Pb‐Sn solder contacts on copper. The microstructure of the joints is described. While the fatigue life of near‐eutectic solder joints is strongly dependent on the operating conditions and on the microstructure of the joint, the metallurgical mechanisms of failure are surprisingly constant. When the cyclic load is in shear at temperatures above room temperature the shear strain is inhomogeneous, and induces a rapid coarsening of the eutectic microstructure that concentrates the deformation in well‐defined bands parallel to the joint interface. Fatigue cracks propagate along the Sn‐Sn grain boundaries and join across the Pb‐rich regions to cause ultimate failure. The failure occurs through the bulk solder unless the joint is so thin that the intermetallic layer at the interface is a significant fraction of the joint thickness, in which case failure may be accelerated by cracking through the intermetallic layer. The coarsening and subsequent failure are influenced more strongly by the number of thermal cycles than by the time of exposure to high temperature, at least for hold times up to one hour. Thermal fatigue in tension does not cause well‐defined coarsened bands, but often leads to rapid failure through cracking of the brittle intermetallic layer. Implications are drawn for the design of accelerated fatigue tests and the development of new solders with exceptional fatigue resistance.

An empirical study was conducted to determine the thermal fatigue behaviour of 1.27 mm pitch, J‐bend and gullwing surface mount solder joints, manufactured with four low‐temperature solders. Selected solder alloys were: 58Bi‐42Sn (wt %), 43Sn‐43Pb‐14Bi, 52ln‐48Sn and 40ln‐40Sn‐20Pb. Accelerated thermal cycling was used in conjunction with metallographic analysis and mechanical (pull) strength measurement to test their behaviour. The relative merit of each solder composition was determined by comparing it with 63Sn‐37Pb solder, subjected to identical testing conditions. The strength decreased linearly with increased number of thermal cycles for gullwing solder joints of all four solder alloys. The fatigue lifetime was relatively longer for 58Bi‐42Sn and 40ln‐40Sn‐20Pb than for other alloys, but significantly lower than that obtained with 63Sn‐37Pb solder. No discernible degradation of strength was observed with the J‐bend solder joints of any solder alloy, even after the completion of 6000 thermal cycles. Thermal fatigue resistance of the latter joints was attributed to a more favourable coefficient of thermal expansion (CTE) mismatch. Solder joint cracking occurred only in gullwing components soldered with 52ln‐48Sn, 40ln‐40Sn‐20Pb and 43Sn‐43Pb‐14Bi alloys, after 1000 or 2000 thermal cycles. The crack initiated on the outside surface of the solder fillet, and appeared to propagate through both phases of the microstructure. The stress‐induced heterogeneous coarsening of the microstructure was evident only with 43Sn‐43Pb‐14Bi solder, although not as prevalent as that usually observed with eutectic Sn‐Pb solder. Fatigue cracks were absent from solder joints of 58Bi‐42Sn and 63Sn‐37Pb alloys.

THE orthodox solution of Lagrangian frequency equations involves the expansion into polynomial form of the characteristic determinantal equation in the latent roots, but this method becomes exceedingly laborious if a large number of frequencies and their associated modes are required accurately for any system of equations of high order, say above the sixth. We define a system of Lagrangian frequency equations to be of the nth order if it consists of n equations for n homogeneous unknowns, which we call modes. A useful contribution to the problem was made by the iteration solution of Duncan and Collar, which is especially valuable when only the highest one or two latent roots are required. But when an aircraft propeller vibration problem required the first seven frequencies and their associated modes for a 12th‐order equation whose coefficients involved a variable pitch angle, the labour of calculation by this method appeared at that time (1941) to be prohibitive. The ‘Escalator’ method was therefore devised jointly by the author and Captain J. Morris of the Royal Aircraft Establishment as an alternative. In the propeller problem all the latent roots involved were necessarily real. Dr L. Fox, using relaxation methods, has recently solved a similar problem in a remarkably short time. Unfortunately, relaxation methods cannot easily be extended to the case of complex latent roots, which can occur in connexion with flutter, radio circuits and other problems. In this paper it is shown how the Escalator method can be adapted without essential change to cases in which complex quantities occur.

In this paper, I demonstrate an alternative explanation to the development of the American electricity industry. I propose a social embeddedness approach (Granovetter, 1985, 1992) to interpret why the American electricity industry appears the way it does today, and start by addressing the following questions: Why is the generating dynamo located in well‐connected central stations rather than in isolated stations? Why does not every manufacturing firm, hospital, school, or even household operate its own generating equipment? Why do we use incandescent lamps rather than arc lamps or gas lamps for lighting? At the end of the nineteenth century, the first era of the electricity industry, all these technical as well as organizational forms were indeed possible alternatives. The centralized systems we see today comprise integrated, urban, central station firms which produce and sell electricity to users within a monopolized territory. Yet there were visions of a more decentralized electricity industry. For instance, a geographically decentralized system might have dispersed small systems based around an isolated or neighborhood generating dynamo; or a functionally decentralized system which included firms solely generating and transmitting the power, and selling the power to locally‐owned distribution firms (McGuire, Granovetter, and Schwartz, forthcoming). Similarly, the incandescent lamp was not the only illuminating device available at that time. The arc lamp was more suitable for large‐space lighting than incandescent lamps; and the second‐generation gas lamp ‐ Welsbach mantle lamp ‐ was much cheaper than the incandescent electric light and nearly as good in quality (Passer, 1953:196–197).

OWING to vibration troubles which occasionally arise in engine crankshaft propeller systems, it has become necessary to investigate such possibilities in the design stage. In this paper we are concerned with the torsional vibration of an engine crankshaft coupled with flexural vibration of the propeller. The engine crankshaft will have a number of throws, which it has become customary to replace by “equivalent” pulleys which have the same moments of inertia as the complete crankthrows and are usually designated as engine “masses”. Assuming that there is a node in the propeller shaft, we may represent the torsional stiffness of the propeller shaft between the gears and the node by ca / (l−γ) where ca is the torsional stiffness of the propeller shaft; the torsional stiffness of the other portion of the propeller shaft will then be ca/γ. The frequencies of torsional vibrations of the engine crankshaft system about the assumed node are found for various values of γ. The corresponding frequencies of flexural vibrations of the propeller arc also found for the same values of γ. The two sets of frequencies may then be plotted against γ, giving engine crankshaft and propeller frequency curves respectively.

The wearout characteristics were investigated for soldered interconnections of surface mount technology (SMT) chip resistors, chip capacitors and a 44 I/O ceramic leaded chip carrier (CLCC) package. Four double‐sided test vehicles were subjected to accelerated thermal cycling in the — 10°C to + 110°C range; 30°C/min ramp rate; and 1 minute dwell time at each temperature extreme. The test was interrupted at initially 500 cycle and later at 1000 cycle intervals to perform visual inspection of all soldered interconnections, functional performance verification for the test vehicles, and resistance measurement on leaded SMT joints. Metallographic examinations and fractographic studies were also performed after 0, 4500 and 13000 cycles to characterise the micromechanisms of soldered joint strength degradation and failure. The wearout thresholds for soldered joints of chip resistors and capacitors on side 1 were respectively 2500 and 4500 cycles. The greater thermal fatigue resistance of the latter joints was attributed to a lower device‐substrate coefficient of thermal expansion (CTE) mismatch and a more favourable device geometry compared with chip resistors. These passive components on side 2, however, showed a virtually identical soldered joint wearout threshold of 6500 cycles. The constraints imposed by the applied mounting adhesive were primarily responsible for this behaviour. No correlation appeared to exist among various failure criteria used to determine the onset of failure for leaded SMT soldered connections. The concurrent monitoring of electrical resistance and the applied tensile load showed a modest relationship between the load drop and resistance increase, however. The test vehicles continued to pass the functional performance verification, even after 13000 thermal cycles. Nonetheless, the joint wearout thresholds were considered to be 2500, 4500 and 4500 cycles for chip resistor, chip capacitor and CLCC components, respectively. A 50% soldered joint strength drop was considered as the wearout threshold for the CLCC device. Metallographic examination showed limited barrel wall cracking of the vias and no evidence of cracks with the through‐hole soldered joints, even after 13000 thermal cycles.

The kinetics of wetting were studied on several different prepared surfaces of copper (Cu) to simulate the microstructure observed in pre‐tinned Cu‐clad printed circuit boards. The results illustrate the effectiveness of pre‐tinning in maintaining the solderability of Cu surfaces. Pre‐tinning with Pb‐rich solder (95Pb‐5Sn) is particularly effective since solderability is preserved even after a relatively long ageing treatment. On the other hand, pre‐tinning with eutectic solder risks the loss of solderability during ageing or baking due to surface exposure of an ε‐phase intermetallic with poor wetting properties. The results also confirm the presence of carbon in pre‐tinned specimens due to the use of flux. The effect of carbon on solderability is not yet known.

A finite element method based investigation is carried out for the determination of three‐dimensional turbulent flow structures and heat transfer rates of cooling ducts within turbine blades which rotate about an axis orthogonal to their own axis of symmetry. The effects of geometrical configurations, Coriolis forces and coolant inertias on the hydrodynamic and thermal characteristics have been systematically predicted and compared with experimental measurements.

The following classified, annotated list of titles is intended to provide reference librarians with a current checklist of new reference books, and is designed to supplement the RSR review column, “Recent Reference Books,” by Frances Neel Cheney. “Reference Books in Print” includes all additional books received prior to the inclusion deadline established for this issue. Appearance in this column does not preclude a later review in RSR. Publishers are urged to send a copy of all new reference books directly to RSR as soon as published, for immediate listing in “Reference Books in Print.” Reference books with imprints older than two years will not be included (with the exception of current reprints or older books newly acquired for distribution by another publisher). The column shall also occasionally include library science or other library related publications of other than a reference character.

The effect of gold (Au) on the reliability of 0.65 mm pitch surface mount solder joints between plastic quad flat packs and Cu‐Ni‐Au FR‐4 printed circuit boards was investigated. Cu‐Ni‐Au is a desirable printed circuit board finish for multi‐chip modules or printed circuit boards that would otherwise require a selective Au finish, for example for edge connectors or wire bondable parts. However, Au is known to embrittle solder when it is present in sufficiently high concentrations, creating a concern that solder joint fatigue life in service will also be adversely affected. This paper reports the results of mechanical shock, mechanical vibration and thermal cycling testing of fine pitch solder joints containing varying amounts of Au. Tests were performed on as‐soldered joints and on joints that had been heat‐treated to evolve the microstructure towards equilibrium. The tests were designed to accelerate in‐service conditions in a typical industrial environment. Under these conditions, the Au concentrations tested did not promote solder joint failures. Microstructural characterisation of the distribution and morphology of the Au‐, Ni‐ and Cu‐Sn intermetallics in the joint before and after accelerated testing was also performed. On the basis of these observations it is recommended that the Au concentration in solder joints between plastic quad flat packs and Cu‐Ni‐Au FR‐4 printed circuit boards not exceed 3.0 wt.%.