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A process for continuous pressing of copper‐clad laminates is described. The consistent quality manufacturing gives higher dimensional stability and better thickness profile of the FR‐4 laminate. The product also meets UL and MIL requirements.

To meet higher requirements on multilayer PCBs, good control of the prepreg parameters is essential. The standard prepreg tests of gel time and flow are insufficient. New test methods such as melt viscosity, scaled flow test and differential scanning calorimetry give the required information. The test methods are compared for different materials. Rheology testing using a melt viscosimeter is an important tool for both prepreg and PCB manufacturers.

The CCA is a non‐profit organisation composed of member companies within the state of California, aimed at providing an environment for information exchange between individuals involved in the printed circuit industry. Each branch holds monthly meetings on state‐of‐the‐art technology. Other benefits of CCA membership include: free admission to Nepcon technical sessions; educational and employment information; reduced fees for the annual fall symposium; and a monthly newsletter.

Today modern epoxy base materials for printed circuit board production are designed with properties which ensure high dimensional stability, resistance to chemical action, and increased glass transition temperature, in order to meet the stringent demands now encountered in electronics use. Polyfunctional epoxy resins and the appropriate hardener/accelerator compositions are in widespread, effective use in the design of superior laminates. The quality of the through‐hole plating for holes drilled in these improved materials will depend on various parameters, including those covered by three main complexes: base material, mechanical processing, and chemical processes used for treatment of the drilled hole. Special attention is paid in this paper to the resin recession phenomenon in terms of processing parameters.