Search results

This study samples 78 business decision‐makers whose cases were part of an alternative dispute resolution (ADR) process, i.e., the Public Construction Commission (PCC), which operates under the government in Taiwan, between 1997 and early 2000. The authors propose an interaction between two variations of trust—category‐based trust and experience‐based trust—and hypothesize that decision‐makers’ perceived identity with new versus old government ideology and past justice experiences (with the PCC) would jointly affect their decision preferences. The results partially support these hypotheses. The authors emphasize the critic role of trustworthiness of the third‐party ADR providers. We conclude with a discussion of the implications of the findings.

This study aims to simulate molded printed circuit board (PCB) warpage behavior under reflow temperature distribution. Simulation models are used to estimate dynamic warpage behavior for different form factor sizes.

This study analyzes warpage during the reflow process. The shadow moiré experiment methodology is used to collect data on the dynamic warpage performance of a model with a form factor of 10mm × 10mm × 1mm. The temperature profile with heating from 25°C to 300°C at intervals of 50°C is used, and the sample is made to undergo a cooling process until it reaches the room temperature. Subsequently, ANSYS static structural simulation is performed on similar form factor models to ascertain the accuracy of the simulation results.

Results show that the deformation and total force induced by coefficient of thermal expansion (CTE) mismatch are examined based on the warpage performance of models with different sizes, that is, 45mm × 45mm × 1mm and 45mm × 15mm × 1mm. Compared with the experimental data, the simulated modeling accuracy yields a less than 5% deviation in the dynamic warpage prediction at a reflow temperature of 300°C. Results also reveal that the larger the model, the larger the warpage changes under the reflow temperature.

The simulated warpage is limited to the temperature and force induced by CTE mismatch between two materials. The form factor of the ball-grid array model is limited to only three different sizes. The model is assumed to be steady, isothermal and static. The simulation adopts homogenous materials, as it cannot accurately model nonhomogeneous multilayered composite materials.

This study can provide engineers and researchers with a profound understanding of molded PCB warpage, minimal resource utilization and the improved product development process.

The accurate prediction of molded PCB warpage can enable efficient product development and reduce resources and production time, thereby creating a sustainable environment.

The literature review points out that warpage in various types of PCBs was successfully examined, and that considerable efforts were exerted to investigate warpage reduction in PCB modules. However, PCB warpage studies are limited to bare PCBs. To the best of the authors’ knowledge, the examination of warpage in a molded PCB designed with a molded compound cover, as depicted in Figure 3, is yet to be conducted. A molded compound provides strong lattice support for PCBs to prevent deformation during the reflow process, which is a topic of considerable interest and should be explored.