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The purpose of this paper is to ascertain chemical changes occurring at various stages involved in processing of silver‐based photoimageable thick films; and to determine ensuing topographical features which other wise appeared to be hindered in 2D scanning electron microscopy.

Surface sensitive techniques, viz. X‐ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) were used.

Interfacial adhesion of silver film with substrate (Al₂O₃) was specifically looked into with respect to role played by photoimaging (before and after exposure to ultra‐violet light). XPS results revealed occurrence of subtle chemical changes in terms of unsaturation to saturation in C−C bonding and also an interesting C−Al bonding which presumably improves mechanical adhesion of unfired film with the alumina substrate. AFM was carried out to examine the surface roughness, particle size, and microstructure of film which are very important from the standpoint of high‐frequency applications.

Surface sensitive techniques like XPS and AFM were exclusively used in order to characterize silver‐based photoimageable thick films.