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Material extrusion-based additive manufacturing is a prominent manufacturing technique to fabricate complex geometrical three-dimensional (3D) parts. Despite the indisputable advantages of material extrusion-based technique, the poor surface and subsurface integrity hinder the industrial application of this technology. The purpose of this study is introducing the hot air jet treatment (HAJ) technique for surface treatment of additive manufactured parts.

In the presented research, novel theoretical formulation and finite element models are developed to study and model the polishing mechanism of printed parts surface through the HAJ technique. The model correlates reflow material volume, layer width and layer height. The reflow material volume is a function of treatment temperature, treatment velocity and HAJ velocity. The values of reflow material volume are obtained through the finite element modeling model due to the complexity of the interactions between thermal and mechanical phenomena. The theoretical model presumptions are validated through experiments, and the results show that the treatment parameters have a significant impact on the surface characteristics, hardness and dimensional variations of the treated surface.

The results demonstrate that the average value of error between the calculated theoretical results and experimental results is 14.3%. Meanwhile, the 3D plots of Ra and Rq revealed that the maximum values of Ra and Rq reduction percentages at 255°C, 270°C, 285°C and 300°C treatment temperatures are (35.9%, 33.9%), (77.6%,76.4%), (94%, 93.8%) and (85.1%, 84%), respectively. The scanning electron microscope results illustrate three different treatment zones and the treatment-induced and manufacturing-induced entrapped air relief phenomenon. The measured results of hardness variation percentages and dimensional deviation percentages at different regimes are (8.33%, 0.19%), (10.55%, 0.31%) and (−0.27%, 0.34%), respectively.

While some studies have investigated the effect of the HAJ process on the structural integrity of manufactured items, there is a dearth of research on the underlying treatment mechanism, the integrity of the treated surface and the subsurface characteristics of the treated surface.

The paper aims to explore the sided challenges facing the accounting profession in an advanced digitalised future where humans and robots will collaborate in working teams.

Employing a qualitative approach, the paper conducts a reflexive thematic analysis to identify challenges and associated socio-ethical risks of digitalisation; it then introduces an ethical decision-making model aimed at addressing these challenges.

Key professional accountants’ (PAs) sided challenges refer to autonomy, privacy, balance of power, security, human dignity, non-maleficence and justice, each of them possessing multifaceted dimensions that are interconnected dynamically to create a complex web of socio-ethical risks.

The ethical decision-making pathways corresponding to each detected challenges provide a useful reference and guideline for PAs in the digitalised future of the profession.

Using an anthropocentric perspective, the research addresses the sided challenges of accounting profession’s accelerated digitalisation; it contributes to fostering accountability and legitimacy of the accounting profession which serves the public interest.

By innovatively intertwining ethical positions with decision-making pathways, the paper offers a potential solution to address digitalisation’s sided challenges that might interfere with practitioners’ professional judgement and identity.

A physically-based elasto-viscoplastic constitutive model is proposed to examine the size effects of the precipitate and blocks on the creep for martensitic heat-resistant steels with both the dislocation creep and diffusional creep mechanisms considered.

The model relies upon the initial dislocation density and the sizes of M₂₃C₆ carbide and MX carbonitride, through the use of internal variable based governing equations to address the dislocation density evolution and precipitate coarsening processes. Most parameters of the model can be obtained from existing literature, while a small subset requires calibration. Based on the least-squares fitting method, the calibration is successfully done by comparing the modeling and experimental results of the steady state creep rate at 600° C across a wide range of applied stresses.

The model predictions of the creep responses at various stresses and temperatures, the carbide coarsening and the dislocation density evolution are consistent with the experimental data in literature. The modeling results indicate that considerable effect of the sizes of precipitates occurs only during the creep at relatively high stress levels where dislocation creep dominates, while the martensite block size effect happens during creep at relatively low stress levels where diffusion creep dominates. The size effect of M₂₃C₆ carbide on the steady creep rate is more significant than that of MX precipitate.

The present study also reveals that the two creep mechanisms compete such that at a given temperature the contribution of the diffusion creep mechanism decreases with increasing stress, while the contribution of the dislocation creep mechanism increases.

This paper aims to present two Anand’s model parameter sets for the multilayer silver–tin (AgSn) transient liquid phase (TLP) foils.

The AgSn TLP test samples are manufactured using pre-defined optimized TLP bonding process parameters. Consequently, tensile and creep tests are conducted at various loading temperatures to generate stress–strain and creep data to accurately determine the elastic properties and two sets of Anand model creep coefficients. The resultant tensile- and creep-based constitutive models are subsequently used in extensive finite element simulations to precisely survey the mechanical response of the AgSn TLP bonds in power electronics due to different thermal loads.

The response of both models is thoroughly addressed in terms of stress–strain relationships, inelastic strain energy densities and equivalent plastic strains. The simulation results revealed that the testing conditions and parameters can significantly influence the values of the fitted Anand coefficients and consequently affect the resultant FEA-computed mechanical response of the TLP bonds. Therefore, this paper suggests that extreme care has to be taken when planning experiments for the estimation of creep parameters of the AgSn TLP joints.

In literature, there is no constitutive modeling data on the AgSn TLP bonds.

The purpose of this paper is to investigate the thermomechanical response of four well-known lead-free die attach materials: sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds.

This examination is conducted through finite element analysis. The mechanical properties of all die attach systems, including elastic and Anand creep parameters, are obtained from relevant literature and incorporated into the numerical analysis. Consequently, the bond stress-strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results indicate that silver-tin TLP bonds are prone to exhibiting higher inelastic strain energy densities, while sintered silver and copper interconnects tend to possess higher levels of plastic strains and deformations. This suggests a higher susceptibility to damage in these metallic die attachments. On the other hand, the more expensive gold-based solders exhibit lower inelastic strain energy densities and plastic strains, implying an improved fatigue performance compared to other bonding configurations.

The utilization of different metallic material systems as die attachments in power electronics necessitates a comprehensive understanding of their thermomechanical behavior. Therefore, the results of the present paper can be useful in the die attach material selection in power electronics.

This study aims to investigate the micro mechanism of macro rheological characteristics for composite modified asphalt.Grey relational analysis (GRA) was used to analyze the correlation between macro rheological indexes and micro infrared spectroscopy indexes.

First, a dynamic shear rheometer and a bending beam rheometer were used to obtain the evaluation indexes of high- and low-temperature rheological characteristics for asphalt (virgin, SBS/styrene butadiene rubber [SBR], SBS/rubber and SBR/rubber) respectively, and its variation rules were analyzed. Subsequently, the infrared spectroscopy test was used to obtain the micro rheological characteristics of asphalt, which were qualitatively and quantitatively analyzed, and its variation rules were analyzed. Finally, with the help of GRA, the macro-micro evaluation indexes were correlated, and the improvement efficiency of composite modifiers on asphalt was explored from rheological characteristics.

It was found that the deformation resistance and aging resistance of SBS/rubber composite modified asphalt are relatively good, and the modification effect of composite modifier and virgin asphalt is realized through physical combination, and the rheological characteristics change with the accumulation of functional groups. The correlation between macro rutting factor and micro functional group index is high, and the relationship between macro Burgers model parameters and micro functional group index is also close.

Results reveal the basic principle of inherent-improved synergistic effect for composite modifiers on asphalt and provide a theoretical basis for improving the composite modified asphalt.

The purpose of this study is to understand the meaning of the term well-being as conceptualised by parents, grandparents, principals and teachers in the Irish primary education system.

A hermeneutic phenomenological approach was adopted to understand the nature and meaning of the phenomenon of well-being. Interviews were carried out with 54 principals, teachers, parents and grandparents from a representative sample of primary schools in Ireland. Each participant was asked the same, open, question: “What does well-being mean to you?” Responses were transcribed verbatim and analysed using a combination of the principles of the hermeneutic circle and Braun and Clarke’s framework for thematic analysis.

Three conceptualisations of well-being were identified (1) well-being is about being happy, (2) well-being is about being healthy and safe and (3) well-being is something you “do”.

To the best of our knowledge this paper is the first of its kind to describe how well-being is conceptualised by adults in Irish primary school contexts. In particular it highlights how neoliberal conceptualisations of well-being as a “thing”, a commodity exchanged on assumptions of individualism, moralism and bio-economism, have crept into the education of our youngest citizens.

The purpose of the present work is to study the impacts of rapid cooling and Tb rare-earth additions on the structural, thermal and mechanical behavior of Bi–0.5Ag lead-free solder for high-temperature applications.

Effect of rapid solidification processing on structural, thermal and mechanical properties of Bi-Ag lead-free solder reinforced Tb rare-earth element.

The obtained results indicated that the microstructure consists of rhombohedral Bi-rich phase and Ag99.5Bi0.5 intermetallic compound (IMC). The addition of Tb could effectively reduce the onset and melting point. The elastic modulus of Tb-containing solders was enhanced to about 90% at 0.5 Tb. The higher elastic modulus may be attributed to solid solution strengthening effect, solubility extension, microstructure refinement and precipitation hardening of uniform distribution Ag99.5Bi0.5 IMC particles which can reasonably modify the microstructure, as well as inhibit the segregation and hinder the motion of dislocations.

It is recommended that the lead-free Bi-0.5Ag-0.5Tb solder be a candidate instead of common solder alloy (Sn-37Pb) for high temperature and high performance applications.

This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue.

The specimens are subjected to JEDEC preconditioning level 1 (85 °C/85%RH/168 h) with five times reflow at 270°C. This is followed by thermal cycling from 0°C to 100°C, per IPC-7351B standards. The specimens' cross-sections are inspected for crack growth and propagation under backscattered scanning electronic microscopy. The decoupled thermomechanical simulation technique is applied to investigate the thermal fatigue behavior. The impacts of crack length on the stress and fatigue behavior of the package are investigated.

Cracks are initiated from the ball grid array corner of the solder joint, propagating through the transverse section of the solder ball. The crack growth increases continuously up to 0.25-mm crack length, then slows down afterward. The J-integral and stress intensity factor (SIF) values at the crack tip decrease with increased crack length. Before 0.15-mm crack length, J-integral and SIF reduce slightly with crack length and are comparatively higher, resulting in a rapid increase in crack mouth opening displacement (CMOD). Beyond 0.25-mm crack length, the values significantly decline, that there is not much possibility of crack growth, resulting in a negligible change in CMOD value. This explains the crack growth arrest obtained after 0.25-mm crack length.

This work's contribution is expected to reduce the additional manufacturing cost and lead time incurred in investigating reliability issues in solder joints.

The work investigates crack propagation mechanisms of microvoid cracks in solder joints exposed to moisture and thermal fatigue, which is still limited in the literature. The parametric variation of the crack length on stress and fatigue characteristics of solder joints, which has never been conducted, is also studied.

In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis.

During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined.

The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations.

This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.