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ISHM invites papers for the above Conference, to be held on 29–31 May 1991 in Rotterdam, The Netherlands. Papers should cover areas such as: design, manufacturing, packaging and interconnection, materials and processing, applications, reliability, components, new technologies, marketing and economics, optoelectronics. Summaries should be in English, length 200–300 words. The deadline for receipt of summaries is 30 September 1990. (For full details, see announcement on pp. 54–55.)

The International Electronic Components Show in Paris in November, 1983, provided the occasion for a very successful meeting of ISHM‐France which attracted 170 attendees. The following presentations were given:

A review of state‐of‐the‐art technology pertinent to tape automated bonding (for fine pitch, high I/O, high performance, high yield, high volume and high reliability) is presented. Emphasis is placed on a new understanding of the key elements (for example, tapes, bumps, inner lead bonding, testing and burn‐in on tape‐with‐chip, encapsulation, outer lead bonding, thermal management, reliability and rework) of this rapidly moving technology.

The Benelux chapter has made a habit of organising meetings with a scientific and commercial accent more or less alternately. This approach has proven to be successful in the past three years. The 1986 Autumn meeting will be another display meeting. A number of papers will be presented by suppliers of materials and equipment for the hybrid and surface mounting industry. In a 300 m2 exhibition room about 25 companies will display their products. The programme of the day leaves ample opportunity for meeting colleagues and suppliers. The meeting will be held in the ‘Jaarbeurs Vergadercentrum’ in Utrecht on 16 October from 9.30–17.00. The annual ISHM‐Benelux general membership meeting will precede the lectures.

Surface Mounting is shown to be the fourth generation of electronic interconnection technology. It has several facets and is seen differently from various viewpoints in the assembly industry. A review of published papers shows that the subject grew during the 1970s with no single inventor and as a result of numerous developments which are now combining into a coherent technology with important compatibility with other recent innovations.

I was an invited speaker to the ISHM‐Benelux meeting. As I arrived early, I also sat in on the committee meeting as an observer. Jos B. Peeters was the outgoing president and the incoming committee was widened to about 15 members compared with the previous 6. Following the unanimous election of all those nominated, the committee reconvened and elected Mr Kwikkers as the new president of ISHM‐Benelux. He is a professor at the Technische Hogeschole in Delft.

ITS: Intertrade Scientific Ltd, the UK based manufacturer of the MCT/Browne InfraRed Reflow Soldering Systems for SMT and Hybrid applications, as part of their aggressive drive into Europe, has announced the signing of a distributor agreement with Maquinaria Suiza SA of Spain. Under the agreement, Maquinaria Suiza will be the sole supplier of the highly successful product range to Spain and Portugal.

The International Society for Hybrid Microelectronics invites the submission of technical papers for presentation at the above event. All original unpublished papers on microelectronics related topics are welcomed.

Alpha Metals Ltd (UK) have announced the appointment of David Crimp to the position of General Manager. Having served the company for four years as Sales Manager, Mr Crimp now assumes complete responsibility for Alpha's entire UK operation. Prior to his appointment with Alpha Metals, he was employed by AMAX in both the UK and France.

This paper describes some recent innovations in design, process and materials in printed circuit laminate technology, which can lead to significant paradigm shifts in the design and application of electronic products. The traditional roles for printed circuit cards and boards have been to provide wiring interconnection capacity, and a robust mechanical structure for the more delicate and costly chips and modules. The advent of surface mount technology eliminated the need for plated‐through holes as anchors for pinned components. The proliferation of light, high performance, multifunction electronic products will lead to light weight, small, low profile printed circuit assemblies. Adding a redistribution layer to the traditional card surface allows flip‐chip‐on‐board and MCM‐L packages as a low‐cost alternative to traditional high density MCM packages, particularly in applications where size, shape and weight are as important as density and performance. Concurrent with the deliberate evolution of traditional printed circuit technology, some important new materials and process innovations have brought about a new generation of laminate capabilities that are particularly important for the future high I/O requirements predicted for the second part of this decade.