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This paper aims to investigate the moisture diffusion behavior in a system-in-package module systematically by moisture-thermalmechanical-coupled finite element modeling with different structure parameters under increasingly harsh environment.

A finite element model for a system-in-package module was built with moisture-thermal-mechanical-coupled effects to study the subsequences of hygrothermal conditions.

It was found in this paper that the moisture diffusion path was mainly dominated by hygrothermal conditions, though structure parameters can affect the moisture distribution. At lower temperatures (30°C~85°C), the direction of moisture diffusion was from the periphery to the center of the module, which was commonly found in simulations and literatures. However, at relatively higher temperatures (125°C~220°C), the diffusion was from printed circuit board (PCB) to EMC due to the concentration gradient from PCB to EMC across the EMC/PCB interface. It was also found that there exists a critical thickness for EMC and PCB during the moisture diffusion. When the thickness of EMC or PCB increased to a certain value, the diffusion of moisture reached a stable state, and the concentration on the die surface in the packaging module hardly changed. A quantified correlation between the moisture diffusion coefficient and the critical thickness was then proposed for structure parameter optimization in the design of system-in-package module.

The different moisture diffusion behaviors at low and high temperatures have seldom been reported before. This work can facilitate the understanding of moisture diffusion within a package and offer some methods about minimizing its effect by design optimization.

A successful process of design concept evaluation has positive influence on subsequent processes. This study aims to consider the evaluation information at multiple stages and the interaction among evaluators and improve the credibility of evaluation results.

This paper proposes a multi-stage approach for design concept evaluation based on complex network and bounded confidence. First, a network is constructed according to the evaluation data. Depending on the consensus degree of evaluation opinions, the number of evaluation rounds is determined. Then, bounded confidence rules are applied for the modification of preference information. Last, a planning function is constructed to calculate the weight of each stage and aggregate information at multiple evaluation stages.

The results indicate that the opinions of the evaluators tend to be consistent after multiple stages of interactive adjustment, and the ordering of design concept alternatives tends to be stable with the progress of the evaluation.

Updating preferences according to the bounded confidence rules, only the opinions within the trust threshold are considered. The attribute information of the node itself is inadequately considered.

This method addresses the need for considering the evaluation information at each stage and minimizes the impact of disagreements within the evaluation group on the evaluation results.