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This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free solder pastes.

The solder pastes investigated are of SAC305 type, Innolot type or they are especially formulated by the manufacturers on the base of (SnAgCu) alloys with addition of some alloying elements such as Bi, In, Sb and Ti to provide low-void contents. The SnPb solder paste – OM5100 – was used as a benchmark. The solder paste coverage of LED solder pads was chosen as a measure of void contents in solder joints because of common usage of this parameter in industry practice.

It was found that the highest coverage and, related to it, the least void contents are in solder joints formed with the pastes LMPA-Q and REL61, which are characterized by the coverage of mean value 93.13% [standard deviation (SD) = 2.72%] and 92.93% (SD = 2.77%), respectively. The void diameters reach the mean value equal to 0.061 mm (SD = 0.044 mm) for LMPA-Q and 0.074 mm (SD = 0.052 mm) for REL61. The results are presented in the form of histograms, plot boxes and X-ray images. Some selected solder joints were observed with 3D computer tomography.

The statistical analyses are carried out on the basis of 2D X-ray images with using Origin software. They enable to compare features of various solder pastes recommended by manufacturers as low voiding. The results might be useful for solder paste manufacturers or electronic manufacturing services.

We consider the kernel-based classifier proposed by Younso (2017). This nonparametric classifier allows for the classification of missing spatially dependent data. The weak consistency of the classifier has been studied by Younso (2017). The purpose of this paper is to establish strong consistency of this classifier under mild conditions. The classifier is discussed in a multi-class case. The results are illustrated with simulation studies and real applications.

This paper aims to review recent literature results on the mechanical response of confined pentamode structures behaving either in the stretching-dominated or the bending-dominated regimes.

The analyzed structures consist of multilayer systems formed by pentamode lattices alternated with stiffening plates and are equipped with rigid or hinged connections.

It is shown that such structures are able to carry unidirectional compressive loads with sufficiently high stiffness, while showing markedly low stiffness against shear loads. In particular, their shear stiffness may approach zero in the stretching-dominated regime.

The presented results highlight the high engineering potential of laminated pentamode metamaterials as novel isolation devices to be used for the protection of buildings against shear waves.