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The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology.

The approach involves theoretical analysis and actual case study by various characterization techniques, such as a stereo microscope, metallographic microscope, scanning electron microscope, energy dispersive spectroscopy, focused ion beam, high-frequency structure simulator, stripline resonator and mechanical test.

To meet PCB signal integrity demands in mm-wave frequency bands, the improving proposals on copper profile, resin system, reinforcement fabric, filler, electromagnetic interference-reducing design, transmission line as well as via layout, surface treatment, drilling, desmear, laminating and electroplating were discussed. And the failure causes and effects of typical reliability issues, including complex permittivity fluctuation at different frequencies or environments, weakening of peel strength, conductive anodic filament, crack on microvias, the effect of solder joint void on signal transmission performance and soldering anomalies at ball grid array location on high-speed PCBs, were demonstrated.

The PCB reliability problem is the leading factor to cause failures of PCB assemblies concluded from statistical results on the failure cases sent to our laboratory. The PCB reliability level is very essential to guarantee the reliability of the entire equipment. In this paper, the summarized technical demands and reliability issues that are rarely reported in existing articles were discussed systematically with new perspectives, which will be very critical to identify potential reliability risks for PCB in 5G mm-wave applications and implement targeted improvements.

Higher education institutions have a critical role in creating and disseminating the knowledge required to address the complex global challenges faced by global society, as summarized in the Sustainable Development Goals (SDGs). This role of higher education is linked with the concept of internationalization, which has recently been called upon to help contribute to tackle the global challenges and meet the SDGs, particularly through more attention to “Internationalization at Home” (IaH). This paper aims to examine the role of higher education in addressing the SDGs, especially with respect to the links between IaH and the SDGs.

A case study of the International Campus of Zhejiang University (iZJU) is conducted to illustrate how iZJU, which is a pioneer of “Internationalization at Home” and an exemplar of sustainable campus in China, contributes to the value of the SDGs and makes an impact.

The authors examine the practice of IaH at iZJU in the dimensions of organization, curriculum, people and campus, and the authors find evidence from the iZJU model in addressing the value of the SDG4, 6, 7, 11, 13, 14, 15, 16 and 17.

First, the authors contribute to the literature on the role of higher education in addressing the SDGs, especially with respect to the links between IaH and the SDGs. Second, the authors contribute to the IaH literature by examining IaH from a Chinese perspective, as there has been little exploration of what IaH means beyond the European context. Third, the authors build on the analytical framework in the IaH literature in the dimensions of organization, curriculum and people and extend with a new dimension of campus. Fourth, the authors show that IaH is a comprehensive approach to include both curriculum internationalization and campus internationalization.