International Journal of Numerical Methods for Heat & Fluid Flow: Volume 15 Issue 1

Analysis and optimization of the thermal performance of microchannel heat sinks

Dong Liu, Suresh V. Garimella

To provide modeling approaches of increasing levels of complexity for the analysis of convective heat transfer in microchannels which offer adequate descriptions of the thermal…

Optimization of thermal resistance of stacked micro‐channel using genetic algorithms

K. Jeevan, G.A. Quadir, K.N. Seetharamu, I.A. Azid, Z.A. Zainal

To determine the optimal dimensions for a stacked micro‐channel using the genetic algorithms (GAs) under different flow constraints.

Thermal analysis of micro‐channel heat exchangers with two‐phase flow using FEM

Pradeep Hegde, K.N. Seetharamu, G.A. Quadir, P.A. Aswathanarayana, M.Z. Abdullah, Z.A. Zainal

To analyze two‐phase flow in micro‐channel heat exchangers used for high flux micro‐electronics cooling and to obtain performance parameters such as thermal resistance, pressure…

Application of computational fluid dynamics simulation tools for thermal characterization of electronic packages

Ravi Kandasamy, Suresh Subramanyam

In the semiconductor electronics industry, effective heat removal from the integrated circuits (IC) chip, through the electronic package to the environment is crucial to maintain…

Forced convection heat transfer from solder balls on a printed circuit board using the characteristic based split (CBS) scheme

P. Nithiarasu, N. Massarotti, J.S. Mathur

To numerically model forced convection heat transfer over arrays of solder balls.

Steady and unsteady thermal analysis of a triple stack cold plate with heat losses

Shiao Lin Beh, C.K. Ooi, G.A. Quadir, K.N. Seetharamu

To provide some new and additional data for the design of a triple stack cold plate.