Table of contents
Microelectronic packaging reliability using the RSM technique
Mei-Ling WuThe purpose of this paper is to identify the critical parameters that influence ball grid array and chip size package fatigue life in a random vibration environment by using a…
Effects of Zn additions on the structure of the soldered Sn-3.5Ag and Cu interfaces
R.L. Xu, Y.C. Liu, C. Wei, L.M. YuThe interfacial structure is vitally important for achieving a good joint reliability during service. The purpose of this paper is to systematically explore the effects of Zn…
Thermomechanically loaded lead-free LGA joints in LTCC/PWB assemblies
Olli Nousiainen, Timo Urhonen, Tero Kangasvieri, Risto Rautioaho, Jouko VähäkangasThe purpose of this paper is to investigate the feasibility of using land grid array (LGA) solder joints as a second-level interconnection option in low-temperature co-fired…
Microstructure and creep properties of Sn-Ag-Cu lead-free solders bearing minor amounts of the rare earth cerium
Liang Zhang, Song-bai Xue, Li-li Gao, Yan Chen, Sheng-lin Yu, Zhong Sheng, Guang ZengThe purpose of this paper is to investigate the effects of minor addition of the rare earth (RE) element cerium, Ce, on the microstructures and creep properties of Sn-Ag-Cu solder…
Study of the effects of PCB surface finish on plasma process time for lead-free wave soldering
G. Takyi, N.N. EkereThe purpose of this paper is to investigate the end point of the plasma cleaning process, in order to save valuable production time and also to prevent the destruction of…
Thermal fatigue behaviour of Al2O3-DBC substrates under high temperature cyclic loading
Guangcheng Dong, Xu Chen, Xinjian Zhang, Khai D.T. Ngo, Guo-Quan LuThe purpose of this paper is to study the phenomenology of Al2O3-DBC substrate thermal-cracking under different high temperature cyclic loadings. The extremely low cycle fatigue…

ISSN:
0954-0911e-ISSN:
1758-6836ISSN-L:
0954-0911Online date, start – end:
1989Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditors:
- Professor Peng He
- Associate Professor Shuye Zhang