Table of contents
A solution of aluminum substrate drilling
Fumin Song, Lianyu Fu, Fei ZhangThe purpose of this paper is to present and describe a solution of aluminum substrate drilling.
Micro‐via approaches for reducing solder voiding
Ping Liu, Xiaolong Gu, Xinbing Zhao, Xiaogang LiuThe purpose of this paper is to evaluate the influence of microvia design on solder joint reliability and to present a printed circuit board (PCB) microvia design approach capable…
The evolution of organic solderability preservatives (OSP) from a temporary protectant to a leadership position in surface finishing chemistry
Michael CaranoThe purpose of this paper is to present an overview of the evolution of organic solderability preservatives (OSP) technology from a temporary anti‐tarnish to an approved process…
Coating thickness measurement of thin gold and palladium coatings on printed circuit boards using X‐ray fluorescence
Simone Dill, Volker RößigerThe purpose of this paper is to compare the performance of X‐ray fluorescence (XRF) instruments with different detector systems (proportional counter, positive intrinsic negative…
Testing and long‐term monitoring within printed circuit board cleaning technology
Štefan SvetskýThe purpose of this paper is to present the development and implementation of a system of test methods for determining the contamination level in cleaning baths and using this…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari