Circuit World: Volume 31 Issue 2


Table of contents

A study of the lead‐free hot air solder levelling process

Jack Fellman

The traditional surface finish for bare boards, eutectic tin‐lead solder from the HASL process, is well characterized, but very little is known about the implementation of lead…

Non‐planar interconnect

Gavin Williams, Luke Seed, Alan Purvis, Andrew Maiden, Richard McWilliam, Peter Ivey

This paper describes a method for patterning fine line interconnections over non‐planar surfaces and introduces the idea of using holographic masks for more challenging geometries.


An investigation of the recommended immersion tin thickness for lead‐free soldering

Sven Lamprecht

This paper describes the different thickness measurement techniques that enable reliable thickness assessments, and the determination of the recommended immersion tin thickness…

Water use in the printed circuit board manufacturing process and approaches for reducing consumption

Martin Goosey

To review water use in the PCB industry and to introduce approaches for minimising its consumption in order to reduce costs, enhance efficiency and to enable PCB producers to…


Renewable resources for use in printed circuit boards

H. Nägele, J. Pfitzer, C. Lehnberger, H. Landeck, K. Birkner, U. Viebahn, W. Scheel, R. Schmidt, M. Hagelüken, J. Müller

This paper focuses on the project “Development of electronic components on circuit boards made of renewable resources” which has the aim of developing materials and technologies…


The far‐REACHing reforms of the European Commission's proposed chemical regulation

Kate Geraghty

Focuses on, and provides a background of, the REACH Regulation, a new system of registration, evaluation and authorisation for chemicals.

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  • Associate Professor Pooya Davari