Table of contents
Drilling Multilayer Glass‐PTFE Circuit Boards
John K. HaggeIn this paper, reproduced by permission of the Institute of Printed Circuits (USA), the author discusses some of the problems encountered when drilling holes which must be plated…
Computer‐Generated Cutting Patterns Reduce Shearing Scrap
Jeff JusticeThe problem of how to cut small, rectangular panels from larger stock‐sized material with minimum scrap is common in many industries. In 1975, Hewlett‐Packard's Palo Alto printed…
Quality Assessment: 8—Degassing
Degassing is a problem generally associated with PWB's having plated through holes. This problem is generally realised when blowholes and/or voids are observed in the solder…
Products ♦ Processes ♦ Materials ♦ Equipment
Electrovert has introduced a new series of bench model systems that combines compact size, streamlined styling, integrated design, proven Lambda zero‐defect wavesoldering and low…
Round the Circuit
“PC Boards for the '80s” is the theme of the 1977 Annual Symposium sponsored by the California Circuits Association and scheduled for Tuesday and Wednesday, October 25–26, at the…
Institute News
At the Annual General Meeting, held at Brunei University on 31st May, it was announced by the Chairman, Mr. Reuben Josephs, that the Association of Circuit Technologists has in…
Epoxies in Thick Film Hybrid Circuits
C. MarshallConductive and non‐conductive epoxies suitable for thick film circuits have been available since about 1970. They were originally intended for mounting semiconductor chips as an…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari