Table of contents
Changes in the PCB world with new packaging technologies and the integration of passive components into the PCB
Dieter G. WeissNew developments in the semi‐conductor industry lead to higher I/O counts. Packaging is changing to new, smaller packages, like TCPs and CSPs, and the pitch density increases as…
Real‐time control of advanced solderability preservatives
Michael FredericksonOrganic and immersion metallic coatings are being used as a replacement for the hot air solder level (HASL) process. Use of these coatings provides advantages for both the…
A new approach to translational laminographic method for PCB inspection
Jinung AnX‐ray laminography, a tomographic technique that can examine individual planes of focus within a 3‐D structure, promises to be an excellent method of inspecting complicated…
Elemental distribution of parts and materials making up an electronic box
B.D. DunnThe various electronic component parts and materials that are used in the construction of spacecraft electronic boxes have been chemically analysed. An elemental distribution is…
Are PCB fabricators ready to fabricate MCM‐L technology?
R. AzizSince the 1960s, interconnection technology has been dominated by implementations of printed circuit board (PCB) technology. However, in response to the ever increasing demand for…
Dry film photoresists ‐ a never ending success story?
Klaus MaurischatReviews the use and development of dry film photoresists and liquid resists. Provides an historical perspective and considers factors affecting investment in the future. Discusses…
ISSN:
0305-6120Online date, start – end:
1974Copyright Holder:
Emerald Publishing LimitedOpen Access:
hybridEditor:
- Associate Professor Pooya Davari