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Innovations in Organics Circuit Packaging Technology

J.M. Brauer (Process and Materials, Endicott Electronic Packaging, IBM Corporation, Endicott, New York, USA)
W.T. Chen (Process and Materials, Endicott Electronic Packaging, IBM Corporation, Endicott, New York, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 April 1994



This paper describes some recent innovations in design, process and materials in printed circuit laminate technology, which can lead to significant paradigm shifts in the design and application of electronic products. The traditional roles for printed circuit cards and boards have been to provide wiring interconnection capacity, and a robust mechanical structure for the more delicate and costly chips and modules. The advent of surface mount technology eliminated the need for plated‐through holes as anchors for pinned components. The proliferation of light, high performance, multifunction electronic products will lead to light weight, small, low profile printed circuit assemblies. Adding a redistribution layer to the traditional card surface allows flip‐chip‐on‐board and MCM‐L packages as a low‐cost alternative to traditional high density MCM packages, particularly in applications where size, shape and weight are as important as density and performance. Concurrent with the deliberate evolution of traditional printed circuit technology, some important new materials and process innovations have brought about a new generation of laminate capabilities that are particularly important for the future high I/O requirements predicted for the second part of this decade.


Brauer, J.M. and Chen, W.T. (1994), "Innovations in Organics Circuit Packaging Technology", Circuit World, Vol. 21 No. 1, pp. 8-17.




Copyright © 1994, MCB UP Limited

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