Solder Joint Reliability of a Thin Small Outline Package (TSOP)

Abstract

The reliability of 0.5 mm pitch, 32‐pin thin small outline package (TSOP) solder joints has been studied by experimental temperature cycling and a cost‐effective 3‐D non‐linear finite element analysis. Temperature cycling results have been presented as a Weibull distribution, and an acceleration factor has been established for predicting the failure rate at operating conditions. Thermal fatigue life of the corner solder joints has been estimated based on the calculated plastic strain, Coffin‐Manson law and isothermal fatigue data on solders. A correlation between the experimental and analytical results has also been made. Furthermore, failure analysis of the solder joints has been performed using scanning electron microscopy (SEM) and an optical method. Finally, a quantitative comparison between the Type‐I and Type‐II TSOP solder joints has been presented.

Citation

Lau, J., Golwalkar, S., Boysan, P., Surratt, R., Forhringer, R. and Erasmus, S. (1993), "Solder Joint Reliability of a Thin Small Outline Package (TSOP)", Circuit World, Vol. 20 No. 1, pp. 12-19. https://doi.org/10.1108/eb046232