High demands are placed on base materials for present‐day printed circuits. The requirements for multilayer materials are examined including satisfying criteria regarding low dielectric constant, high glass transition temperature and dimensional stability. Comparisons are made involving different resin systems and reinforcement materials. Improvements in material characteristics are often accompanied by disadvantages in terms of processability, copper peel strength and price. The properties of a number of paper‐based laminates and their requirements are discussed. It is concluded that no ‘ideal’ base material is available which simultaneously fulfills all demands including price.
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