The Electronic Industries Association (EIA) has announced the release of EIA‐364‐71, Solder Wicking Test Procedure for Electrical Connectors/Sockets (Wave Solder Technique), formerly Standards Proposal No. 2185‐A. The object of this test is to determine whether a connector can be wave soldered to a printed wiring board without sustaining damage caused by solder wicking onto the contact surfaces or other areas that might alter its operating characteristics.
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