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Electro‐optical Board Technology Based on Discrete Wiring

W. Delbare (Alcatel Bell Telephone, Antwerp, Belgium)
L. Vandam (Alcatel Bell Telephone, Antwerp, Belgium)
J. Vandewege (University of Ghent, Laboratory of Electromagnetism and Acoustics, Ghent, Belgium)
J. Verbeke (University of Ghent, Laboratory of Electromagnetism and Acoustics, Ghent, Belgium)
M. Fitzgibbon (AIT, Islip, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 February 1992

Abstract

The paper describes a new electro‐optical board technology, based on the discrete wiring principle. Isolated copper wires are embedded in the circuit board to realise the electrical interconnections. Glass optical fibres are embedded to obtain optical interconnections. The technology allows for crossovers and for electrical and optical interconnections on one layer of interconnection. As the technology can be applied on the level of package or multichip module, circuit board and backpanel, it has the ability to offer a complete solution for chip to chip electrical and optical interconnections. The paper will describe the basic manufacturing technology of the boards. The benefits of the technology from a system designer's viewpoint will be addressed. The problem of coupling light in and out of the embedded optical fibres will be discussed and the realisation of a first on‐board optical link via embedded optical fibres will be described.

Citation

Delbare, W., Vandam, L., Vandewege, J., Verbeke, J. and Fitzgibbon, M. (1992), "Electro‐optical Board Technology Based on Discrete Wiring", Circuit World, Vol. 18 No. 3, pp. 11-16. https://doi.org/10.1108/eb046164

Publisher

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MCB UP Ltd

Copyright © 1992, MCB UP Limited