To read the full version of this content please select one of the options below:

A New Technology for the Design and Manufacture of Two‐layer and Multilayer ‘Semi‐flexible’ Circuits for Automotive Applications

J. Kemkes (Du Pont de Nemours, Germany)
F. Melchior (Du Pont de Nemours, Germany)
M. Weinhold (Du Pont de Nemours International, Switzerland)

Circuit World

ISSN: 0305-6120

Article publication date: 1 January 1992

Abstract

Insulated Metal Substrates (IMS) have been used in the automotive industry for a number of years. The popularity of this technology is due to the good thermal conductivity of the thin insulation material, which is more effective than convection cooling, and the high temperature performance of the adhesive used for under‐bonnet applications. This paper describes how IMS circuits can be designed and manufactured with two or more layers without using the traditional plating processes.

Citation

Kemkes, J., Melchior, F. and Weinhold, M. (1992), "A New Technology for the Design and Manufacture of Two‐layer and Multilayer ‘Semi‐flexible’ Circuits for Automotive Applications", Circuit World, Vol. 18 No. 2, pp. 27-31. https://doi.org/10.1108/eb046156

Publisher

:

MCB UP Ltd

Copyright © 1992, MCB UP Limited