Correlation of Chemical Microstructure with Solderability of PCBs
J.L. Marshall
(The Center for Materials Characterization, University of North Texas, Denton, Texas, USA)
D.E. Miiller
(The Center for Materials Characterization, University of North Texas, Denton, Texas, USA)
J. Sees
(The Center for Materials Characterization, University of North Texas, Denton, Texas, USA)
S.E. Matteson
(The Center for Materials Characterization, University of North Texas, Denton, Texas, USA)
D. Weathers
(The Center for Materials Characterization, University of North Texas, Denton, Texas, USA)
L. Lichtenberg
(Advanced Manufacturing Technology, Motorola Inc., Scottsdale, Arizona, USA)
15
Abstract
A combination of analytical methods was used on printed circuit board coupons to conclude the following: (1) while steam ageing deteriorates solderability of tinned coupons, it does not increase the oxide thickness or tin‐lead ratio of the surface (top 50 Angstroms) of tinned coupons; (2) therefore, some other factor, probably oxidation of the copper or tin/copper intermetallic substrate, determines solderability of the coupons.
Citation
Marshall, J.L., Miiller, D.E., Sees, J., Matteson, S.E., Weathers, D. and Lichtenberg, L. (1991), "Correlation of Chemical Microstructure with Solderability of PCBs", Circuit World, Vol. 18 No. 1, pp. 17-21. https://doi.org/10.1108/eb046150
Publisher
:MCB UP Ltd
Copyright © 1991, MCB UP Limited