Advanced Multilayer Bonding Technology
M. Huschka
(Norplex Oak Europa, Wipperfürth, Germany)
36
Abstract
Continuously increasing requirements drive multilayer manufacturers to search for advanced manufacturing technologies and to evaluate new materials. This paper provides an insight into new multilayer bonding methods, improvements offered by laminators, and why to select high performance materials for special applications.
Citation
Huschka, M. (1991), "Advanced Multilayer Bonding Technology", Circuit World, Vol. 18 No. 1, pp. 9-13. https://doi.org/10.1108/eb046148
Publisher
:MCB UP Ltd
Copyright © 1991, MCB UP Limited