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PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System

K. Minten (Digital Equipment Corporation, Greenville, South Carolina, USA)
J. Toth (Digital Equipment Corporation, Greenville, South Carolina, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 March 1991

Abstract

Two current full build electroless copper deposits were investigated. This paper demonstrates that there are fundamental differences in the nature of their deposits. The consequences of these differences are highlighted for the PWB manufacturer.

Citation

Minten, K. and Toth, J. (1991), "PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System", Circuit World, Vol. 17 No. 4, pp. 19-26. https://doi.org/10.1108/eb046143

Publisher

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MCB UP Ltd

Copyright © 1991, MCB UP Limited