The trend towards high speed digital processing has stimulated the need for new substrate materials with superior electrical properties for multilayer printed wiring board (PWB) applications. Two important electrical substrate parameters are dielectric constant and dissipation factor. This study examines the effect of combining different resin and fibre systems for altering or possibly improving electrical performance. Resin systems studied include FR‐4, cyanate ester and polytetrafluoroethylene. Materials used for reinforcement include E‐glass, S‐glass and polytetrafluoroethylene based fibres. Results of the electrical and thermal characterisation work on the test vehicles built based on the mixed resin and fibre systems are reported.
Blackshaw, M.F., Lee, L.H. and Burt, R. (1991), "The Thermal and Electrical Characterisation of PWB Test Vehicles Built with Low Dielectric Constant Materials", Circuit World, Vol. 17 No. 4, pp. 11-14. https://doi.org/10.1108/eb046141
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