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A New Adhesive System for Heat Sink Bonding

S. Hamilton (Clyde Product Technology Ltd, Bridge of Weir, Scotland)

Circuit World

ISSN: 0305-6120

Article publication date: 1 January 1991

Abstract

Current techniques for bonding thermal planes or heat sinks utilise materials and methods initially designed for other applications and so have several disadvantages. The new system described in this paper has been developed to give the optimum combination of bonding properties for this specific application.

Citation

Hamilton, S. (1991), "A New Adhesive System for Heat Sink Bonding", Circuit World, Vol. 17 No. 2, pp. 16-17. https://doi.org/10.1108/eb046122

Publisher

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MCB UP Ltd

Copyright © 1991, MCB UP Limited