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New Reliable Methods of Measuring Temperature Distribution on Printed Boards during Operation

A. Sihlbom (IVF, The Swedish Institute of Production Engineering Research, Göteborg, Sweden)
H. Svärd (IVF, The Swedish Institute of Production Engineering Research, Göteborg, Sweden)

Circuit World

ISSN: 0305-6120

Article publication date: 1 February 1990

28

Abstract

IVF has developed two new temperature measurement methods for PC boards and microelectronic devices as a result of Swedish national research programmes. This paper presents and explains how one can achieve a reliable temperature map using an IR scanner. First a method to compensate the large measurement errors due to variation of local factors of emissivity of the object surface is described. The second method makes it possible to use an IR scanner to measure a temperature map over a printed board assembly located inside a narrow cabinet.

Citation

Sihlbom, A. and Svärd, H. (1990), "New Reliable Methods of Measuring Temperature Distribution on Printed Boards during Operation", Circuit World, Vol. 16 No. 3, pp. 7-10. https://doi.org/10.1108/eb046078

Publisher

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MCB UP Ltd

Copyright © 1990, MCB UP Limited

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