Inspection and Data Measurements for Solder Quality Process Control

Abstract

Solder quality is a critical issue in circuit board production. However, the manufacturing process of today has few built‐in controls to ensure good solder quality. Instead, attention is only paid when a defect is found. The solution lies in the integration of inspection, test and process control. Now a new method, Scanned‐Beam Laminography, takes 3‐dimensional X‐ray slices of solder joints, enabling thorough inspection of each joint. Special software algorithms measure and report the solder joint conditions, creating a system which provides real‐time process control.

Citation

Adams, J. (1989), "Inspection and Data Measurements for Solder Quality Process Control", Circuit World, Vol. 16 No. 1, pp. 19-23. https://doi.org/10.1108/eb046065