Base, Substrate Materials for the Construction of Electronic Assemblies; Special Application of Surface Mount Technology Printed Circuit Boards

Abstract

The general section of the paper discusses in detail the demands of SMD‐Technology on Printed Circuit Boards, namely dimensional, thermal, electrical and chemical requirements on both substrates and finished PCBs, besides characteristic features of the production process and the overall performance of the assembly. The second part is concerned with a survey of materials and methods suitable for the needs of SMT printed circuitry. Emphasis is laid on appropriate substrates, thermal management of assemblies and PCBs for high speed/high frequency applications

Citation

Angstenberger, A. (1986), "Base, Substrate Materials for the Construction of Electronic Assemblies; Special Application of Surface Mount Technology Printed Circuit Boards", Circuit World, Vol. 12 No. 4, pp. 44-47. https://doi.org/10.1108/eb043836