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Vapour Phase Soldering of SMDs—Reliability Characteristics

G. Caswell (Tracor Aerospace, Austin, Texas, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 March 1985



This paper will outline a viable, in use, production process that focuses on the utilisation of vapour phase soldering. The process will address the soldering of surface mounted devices, the repeatability of solder joint quality, and the resultant environmental characteristics of assemblies produced using the mentioned techniques. The paper will also address the field history obtained by SMD hardware produced at the author's company, to illustrate the environments into which vapour phase soldered joints can be successfully implemented.


Caswell, G. (1985), "Vapour Phase Soldering of SMDs—Reliability Characteristics", Circuit World, Vol. 11 No. 4, pp. 17-27.




Copyright © 1985, MCB UP Limited

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