Outgassing of Solder Joints: ‘Causes and Cures?’
S. Jones
(Manchester Circuits, Manchester, England)
P. Starkey
(Forward Circuits, Tamworth, Staffordshire, England)
41
Abstract
Financial and commercial pressures have led to the increasing trend for PCB users to want to reduce or eliminate rework after mass soldering. Whilst the phenomenon of outgassing is recognised, it is not generally well understood by either the manufacturers or users of PCBs. It is the intention of this paper to clarify and focus attention upon some apects of the problem from the manufacturing side of the industry.
Citation
Jones, S. and Starkey, P. (1983), "Outgassing of Solder Joints: ‘Causes and Cures?’", Circuit World, Vol. 9 No. 4, pp. 37-39. https://doi.org/10.1108/eb043707
Publisher
:MCB UP Ltd
Copyright © 1983, MCB UP Limited