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Troubleshooting in the Electroless Copper Process

Frank E. Stone (Enthone Inc, Newhaven, Conn., USA.)

Circuit World

ISSN: 0305-6120

Article publication date: 1 January 1977

47

Abstract

In this paper, reproduced by permission of the Institute of Printed Circuits (USA), the author discusses the factors which can affect the quality and adhesion of electroless copper plating on printed circuit boards and recommends procedures to ensure optimum results.

Citation

Stone, F.E. (1977), "Troubleshooting in the Electroless Copper Process", Circuit World, Vol. 3 No. 2, pp. 14-15. https://doi.org/10.1108/eb043551

Publisher

:

MCB UP Ltd

Copyright © 1977, MCB UP Limited

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