Surface mount technology: prospects and pitfalls

Abstract

Surface‐mounted components (SMC) for placement on hybrid substrates and small boards for miniaturised products have been in use for almost 20 years. Still, it is a fairly new technology to most designers and printed‐circuit board (PCB) assembly operations even in the US, the leading industrial nation. Surface mount technology is still in its infancy and subject to strong cross currents. There is no doubt that SMC packages will be substituted for through‐hole packages. The question is the speed at which SMCs can penetrate the market and the volumes of assemblies they can represent. The fact that more than half the components on new boards could be SMCs by the end of the decade does not mean that half of all the components assembled in the US, for example, at that time will be in an SMC format. A major issue with SMT today is the short‐term vs. long‐term prospects.

Citation

Mangin, C. and McClelland, S. (1987), "Surface mount technology: prospects and pitfalls", Assembly Automation, Vol. 7 No. 1, pp. 24-26. https://doi.org/10.1108/eb004205