Polar launches Speedflex HDI flex-rigid and high-density interconnect stackup design and documentation system

Citation

(2012), "Polar launches Speedflex HDI flex-rigid and high-density interconnect stackup design and documentation system", Circuit World, Vol. 38 No. 1. https://doi.org/10.1108/cw.2012.21738aaa.007

Polar launches Speedflex HDI flex-rigid and high-density interconnect stackup design and documentation system

Article Type: New products From: Circuit World, Volume 38, Issue 1

Polar Instruments announces Speedflex HDI which supports stackup design for both high-density interconnect (HDI) and flex-rigid PCBs and provides detailed documentation which allows the most complex stackups, to be communicated accurately throughout the supply chain.

Speedflex HDI collates libraries of materials, costs and suppliers, with critical design data such as transmission-line specifications for impedance control, across an unlimited number of PCB layers and cross-sections. This allows OEMs and PCB fabricators or brokers to dramatically reduce the time required to identify the most cost-effective materials whilst maintaining target performance and increasing manufacturing yields.

By using Speedflex HDI’s Virtual Material Mode, designers and fabricators can fully explore how different combinations of materials, including flexible adhesives, bond ply and flexible core, will affect the cost and performance of the finished PCB. Compatibility with Polar’s industry-standard field-solvers adds single-click calculations for impedance control and for managing transmission line losses throughout the build.

The navigator graphical stackup display highlights the flex areas within the flex-rigid PCB and allows users to display layers in transparent, invisible or 3D mode. Users can allocate individual colours to different materials for easy identification and re-order and re-name sub-stacks simply by moving the selected stack within the navigator window.

Detailed information on the finished stack can be exported in a range of formats to provide professional and accurate documentation which can be shared at every stage of the PCB supply chain. This eliminates errors and enhances control throughout the manufacturing process. Compatibility with third-party design-for-manufacture (DFM) tools also allows Speedflex HDI to generate error-free documentation from Ucamco and Zuken DFM tools.

Speedflex HDI is available as a standalone system or as a combined system with Polar’s industry-standard field-solvers: the Speedflex HDI PCB version integrates the Si8000m impedance field solver; whilst Speedflex HDI Si integrates the Si9000e PCB transmission-line field solver. Adding Polar’s Atlas Si GHz-PCB test system and CGen Si coupon generator to the Si9000e insertion-loss control tools in Speedflex HDI Si provides a system which can be used to control insertion losses throughout the fabrication process.

For more information please contact web site: www.polarinstruments.com