Citation
(2003), "Stacked vias technology", Circuit World, Vol. 29 No. 3. https://doi.org/10.1108/cw.2003.21729cad.005
Publisher
:Emerald Group Publishing Limited
Copyright © 2003, MCB UP Limited
Stacked vias technology
Stacked vias technology
To support the Flat-Pad methodology DDi Europe is also developing a filled via solution which is a screen printed (DDi Flat-Fill process) or plated process (DDi Flat-Plate process) that does not require any design modifications. Furthermore, the implementation of stacked vias technology, when combined with Flat-Pad, results in the additional reduction of real estate and increase in board density.
For further information, contact john.calvert@eu.diglobal.co.uk