Rogers to manufacture and expand line of liquid photoimageable covercoats

Citation

(2000), "Rogers to manufacture and expand line of liquid photoimageable covercoats", Circuit World, Vol. 26 No. 4. https://doi.org/10.1108/cw.2000.21726dad.007

Rogers to manufacture and expand line of liquid photoimageable covercoats

Rogers to manufacture and expand line of liquid photoimageable covercoats

Keywords Rogers, Coatings

In response to rapid growth in high density flexible interconnect opportunities, Rogers Corporation has announced that it will manufacture its R/flex1 8080 line of liquid photoimageable covercoat (LPI) materials in the USA, to serve US and European customers. Since 1997, Rogers has had a distribution agreement with Nippon Polytech Corporation of Japan to supply Nippon Polytech's LPI covercoats to Rogers customers. A new agreement between Rogers' and Nippon Polytech allows Rogers to broaden the range of products it will offer – by developing new LPI formulations that meet the constantly evolving needs of its customers – and to manufacture the covercoat products in the USA.

Diana Williams, market development manager for the LPI materials, commented, "We are seeing very rapid movement to this covercoat technology, as fabricators meet the emerging density requirements for smaller, lighter, and higher performance interconnections. While wireless communication equipment manufacturers continue to lead this movement, we are also seeing the new technology applied in a broad variety of products using flexible circuits. Quite simply, LPIs allow higher density circuitry and yield improvements over current materials".

Rogers LPI covercoats enable the fabrication of extremely fine-lined and dense flexible circuits. The technology allows direct image-to-image replication of fine patterns, with exceptionally high resolution, thereby increasing the functionality of the circuit while reducing its real estate requirements. When the LPI covercoats are used with Rogers R/flex1 brand high performance flexible circuit materials, the resulting flexible interconnections can withstand rigorous thermal and chemical environments and circuit bending requirements.

Additional advantages of the R/flex 8080 technology include reduction of processing and tooling costs for circuit fabricators, by eliminating the expense and time of many punching, drilling, and lamination steps required with conventional film-based products. Liquid covercoats also allow material cost reductions by providing excellent circuit protection with a thinner layer than conventional film-based products.

For further information, please visit: www.rogers-corp.com