BondFilm - the oxide replacement system from Atotech

Circuit World

ISSN: 0305-6120

Article publication date: 1 June 2000




(2000), "BondFilm - the oxide replacement system from Atotech", Circuit World, Vol. 26 No. 2.



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

BondFilm - the oxide replacement system from Atotech

Keywords Atotech, Multilayers, Printed circuit boards

The traditional black oxide process in use today has reached its performance limit, resulting in many production problems including wedge voids, pink ring, and uncontrolled crystal formation. Handling, safety, and environmental issues demand that modern alternatives become available for the PCB industry.

The Atotech, 3-step BondFilm System, offers a viable oxide replacement system for future-oriented multilayer production.

It was formulated to be a highly reliable process, with a wide operating window, and when used with Atotech's specifically developed horizontal equipment, the system becomes a truly Integrated production tool. The superior resistance to acid attack produced by BondFilm prevents wedge voids and pink ring. In HDI (high density interconnect) and fine line technology, BondFilm is resistant to uncontrolled crystal formation - which so often results in short circuiting with traditional oxide processes. Extended storage times prior to lamination are possible. BondFilm is compatible with all standard base materials. BondFilm also has an eye on the environment, producing significantly less waste water and an effluent that is much easier to handle.

A three-step process with reduced contact times means a faster system and lower total production costs. A typical processing speed of 3 m/min corresponds to an annual capacity of 600,000 sqm of innerlayers, yet when equipped with state of the art components the latest Atotech systems are suitable for the thinnest materials (50µm).

For further information, please contact: GÏlseven Onbasi. Tel: +49 30 34985 880; E-mail:

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