Stannatech - innovative immersion tin system

Circuit World

ISSN: 0305-6120

Article publication date: 1 June 2000




(2000), "Stannatech - innovative immersion tin system", Circuit World, Vol. 26 No. 2.



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

Stannatech - innovative immersion tin system

Keywords Atotech, Tin plating

Atotech's new Stannatech process offers a unique system of immersion tin-plating as an alternative to HASL. The tin coating is suitable for both soldering (wave and reflow soldering) and press-fit. Stannatech is compatible with lead-free soldering, already meeting the European requirements for electronics and PCB production, which do not take effect until 2004. The economical system comprises just four process stages and can be used in both horizontal and vertical plating systems.

Stannatech deposits a uniform, pure layer of tin (1mm) and is therefore particularly suited to SMT applications for computers and consumer electronics, where planar surfaces and long storage times (at least one year) are required.

A special reprocessing system in the immersion tin-plating bath allows virtually unlimited bath life. This reprocessing system is used to precipitate the concentrated copper, keeping the deposition conditions constant and maintaining the high quality of the Stannatech SN tin coating. The entire process is completely halogen-free and is supplied in ready-to-use chemistry.

For further information, please contact: GÏlseven Onbasi. Tel: +49 30 34985 880; E-mail:

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