Park Electrochemical Corp. announces the appointment of Robert A. Forcier as president of Park's Neltec, Inc. subsidiary

Circuit World

ISSN: 0305-6120

Article publication date: 1 March 2000

Keywords

Citation

(2000), "Park Electrochemical Corp. announces the appointment of Robert A. Forcier as president of Park's Neltec, Inc. subsidiary", Circuit World, Vol. 26 No. 1. https://doi.org/10.1108/cw.2000.21726aab.013

Publisher

:

Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Park Electrochemical Corp. announces the appointment of Robert A. Forcier as president of Park's Neltec, Inc. subsidiary

Park Electrochemical Corp. announces the appointment of Robert A. Forcier as president of Park's Neltec, Inc. subsidiary

Keyword Park Electrochemical Corporation

Park Electrochemical Corp. has announced the election of Robert A. Forcier as the president of Park's Neltec, Inc. subsidiary located in Tempe, Arizona. Mr Forcier was also recently elected as senior vice president, advanced products marketing of Park Electrochemical. Mr Forcier will retain that title and area of responsibility, but will, effective immediately, also take on the full-time responsibility for the leadership of the Neltec business.

Neltec, Inc. is one of eight global "Nelco" businesses owned by Park Electrochemical. Neltec specializes in the manufacturing and marketing of advanced materials for applications such as high density interconnects (HDI), high speed/low loss applications, chip packaging and very high temperature printed circuit boards (for applications such as military electronics and burn-in boards). Neltec's new applications engineering and design team (which also will be led by Mr Forcier) specializes in the introduction of advanced materials into the high-technology printed circuit board marketplace. In addition, Neltec is the home of one of Park's principal research and development laboratories. Several next generation materials are currently under development at Park's R&D laboratories, including wide bandwith materials (10Ghz), nonbrominated materials, micro-via resin coated coppers, embedded passives and ultra-thin materials.