Wire Bonding in Microelectronics

Citation

Yang, J. (2011), "Wire Bonding in Microelectronics", Assembly Automation, Vol. 31 No. 4. https://doi.org/10.1108/aa.2011.03331daa.013

Wire Bonding in Microelectronics

Wire Bonding in Microelectronics

Article Type: Book review From: Assembly Automation, Volume 31, Issue 4

George Harman,McGraw-Hill Professional,New York, NY ,2010,$89.95,446 pp.,ISBN: 9780071476232,www.mhprofessional.com/product.php?isbn=0071476237,

Wire bonding has been an important interconnection technology in the microelectronics industry which might not be able to be replaced in the foreseeable future, even though other interconnection technologies, particularly flip-chip technology is growing at a faster rate. The book entitled Wire Bonding in Microelectronics is devoted to the topic of wire bonding and related areas by the author George G. Harman, who is life fellow of IEEE and IMAPS, and a retired fellow of the National Institute of Standards and Technology (NIST).

The book begins with a technical introduction to its third edition by emphasizing new technical areas (i.e. Cu wire bonding, fine-pitch bonding, as well as different pad metallurgies) in wire bonding, the latest technological trends of wire bonding, and new corresponding materials added to its third version.

The book is divided into relatively independent chapters coupled with chapter-specific references. The following chapters include: ultrasonic bonding technologies, failures and yield problems of wire bonding, wire bonding test, metallurgy and material topics related with wire bonding, mechanical issues in wire bonding and specialized wire bonding technologies. Facing the high-speed development and wire application of computerized aided engineering, this book also provides a chapter focused on modeling and simulation techniques, and its application to the wire bonding process.

The book, in its third edition, brings more diverse knowledge to the audience via special appendixes and chapters from several invited authors. The materials in this third edition are current, and should remain relevant for some time, because the topics broadly cover areas of wire bonding and basic issues that need to be addressed, including failures and yield problems of wire bonding, and that will not change. This book assumes that the readers have a basic knowledge of wire bonding, component and/or device packaging, and circuit assembly technology. In sum, this book will be of interest to engineers, scientists, researchers and students in all areas of the wire bonding.

Jin Yang