Cranfield develops revolutionary technology for manufacturing micro-scale devices

Assembly Automation

ISSN: 0144-5154

Article publication date: 3 August 2010

48

Citation

(2010), "Cranfield develops revolutionary technology for manufacturing micro-scale devices", Assembly Automation, Vol. 30 No. 3. https://doi.org/10.1108/aa.2010.03330cab.001

Publisher

:

Emerald Group Publishing Limited

Copyright © 2010, Emerald Group Publishing Limited


Cranfield develops revolutionary technology for manufacturing micro-scale devices

Article Type: News From: Assembly Automation, Volume 30, Issue 3

Cranfield University has developed new technology that could significantly reduce the manufacturing cost of complex micro-mechanical and micro-optical devices.

The project, part of a €3.2 million research consortium entitled quality to micro (Q2M) supported by the European Union, addressed some of the key issues with existing micro-fabrication processes which are limited by the conflicting requirements of different materials.

“Standard micro-fabrication techniques are often incompatible with high quality transducer materials such as shape memory alloys and functional ceramics,” said Stephen Wilson, Senior Research Fellow in Microsystems Technology at the Cranfield University.

“This is one of the major bottlenecks for the development of novel micro-scale systems. The new technology enables multi-material devices to be made that do not conform to the usual silicon MEMS stereotype. It will bring down the cost of genuinely new systems considerably.”

The new methods can be used in the manufacture of a myriad of components and systems ranging in size from a few millimetres to a few 100 s of nanometres. Applications include newly emerging technologies for personal healthcare such as biomedical devices that can diagnose disease and electronically administer drugs, electronic noses to sniff out explosives or dangerous chemicals and environmental control systems for personal healthcare. The technology also has the potential to open up new applications in communications as it offers the ability to incorporate previously incompatible non-silicon materials into radio-frequency (RF) circuits, thereby enhancing performance and capability.

In the same project Dr Paul Kirby collaborating with the IBM Research Centre in Zurich and the research establishment VTT in Finland, demonstrated that a 1 μm thick layer of piezoelectric material could be incorporated into RF micro-switches such as those found in mobile phone systems.

“This is a significant achievement that could open up new application areas in high-speed telecommunications” Dr Kirby says.

The Q2M Consortium, a three year Strategically Targeted Research Project supported under the European Union 6th Framework Project, comprised 12 academic partners and industrial companies engaged in technology development. The group also included a number of technology end-users to ensure the work addressed real industrial needs. The technologies developed through Q2M have subsequently been used to produce micro-valves, silicon micro-mirror arrays and RF micro-components.

For further information, please visit the web site: www.cranfield.ac.uk

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