Assembleon upgrades popular chipshooter for improved versatility and lower cost per placement

Citation

(2001), "Assembleon upgrades popular chipshooter for improved versatility and lower cost per placement", Assembly Automation, Vol. 21 No. 3. https://doi.org/10.1108/aa.2001.03321cad.003

Assembleon upgrades popular chipshooter for improved versatility and lower cost per placement

Assembleon upgrades popular chipshooter for improved versatility and lower cost per placementKeywords: Assembleon, Machinery, Product development

In line with its commitment to keep the capability of its GemLine component placement machines abreast of market requirements, Assembleon (formerly Philips Electronic Manufacturing Technology) has introduced upgrades to the Topaz high-speed chipshooter which further extend its flexibility, while taking the GemLine platform into higher-volume applications (see Plate 3).

The Topaz-X strikes a perfect balance between high-speed production and a very large component mix. Placing components ranging from 0201 through CSPs, BGAs and 32mm² fine-pitch QFPs, it achieves placement speeds up to 18,000 components per hour. The Topaz-X extends capability even further with the microprocessor-controlled ITF2 feeders, already proven on Assembleon's PowerLine platforms. These allow the GemLine machine to be aligned with both the FCM and the new advanced component mounter (ACM) to provide a powerful, multi-functional manufacturing resource, placing components from 0201s to the finest-pitch flip-chips.

Plate 3 The upgraded Topaz high-speed chipshooter from Assemble¨on (formerly Philips Electronic Manufacturing Technology)

Retaining the accuracy and reliability which are the hallmarks of the GemLine range, these aggressive new Topaz configurations are designed to capture a larger slice of the market by further driving down cost per placement.

Components are picked from any mix of feeders by eight placement heads with an advanced new vision system and improved multi-angle illumination, achieving better component recognition and reduced alignment time. Recognition time is cut to 0.2 seconds per chip, and up to eight CSPs can be aligned simultaneously. With the addition of an extra camera, the Topaz-X is equipped for pre-placement inspection or BGAs and QFPs.

Performance is also enhanced by a nozzle exchange on-the-fly option which can be fitted on up to four placement heads. Any one of three different head-mounted nozzles can be selected as the head moves between the board and the component feeder, eliminating time-consuming transits to a separate nozzle exchange unit.

Feeders are mounted on a feedbar which is trolley mounted, allowing offline set-up to minimise downtime. As well as large bulk feeders, dual-shuttle feeders are now available, enabling replenishment without interrupting machine operation. An alternative approach is the use of a dual tray stacker, which allows one stacker to be filled while the other is in operation. Together with these features for fast replenishment or change-overs, which are achieved in minutes rather than hours as on competing machines, the robust construction and inherent reliability of the Topaz contribute to unparalleled machine up-time.

The Topaz retains its compatibility with other GemLine machines, providing manufacturers with unmatched flexibility for tuning placement capability to current and future production requirements. In addition to the hardware upgrades, improved software for both all-GemLine and multi-vendor lines provides an integrated environment for configuring and optimising production runs.

For further information contact Ko Korteknie, Assembleon, Regional Centre Europe, Building HVM, PO Box 218, 5600 MD Eindhoven. Tel: +31 40 2766264; Fax: 31 40 2766541.