Effect of substrate structures on the morphology and interfacial bonding properties of copper films sputtered on polyester fabrics
International Journal of Clothing Science and Technology
ISSN: 0955-6222
Article publication date: 6 March 2017
Abstract
Purpose
The purpose of this paper is to discuss polyester fabric structures in terms of the surface morphology, crystal structure of copper films and interfacial bonding properties between polyester fabrics and copper films.
Design/methodology/approach
Nanoscale copper (Cu) thin films were deposited onto the surface of polyester fabrics with different structures by the radio frequency magnetron sputtering technique at room temperature.
Findings
Copper films uniformly deposited on the surface of the polyester nonwovens and nanofiber membranes have larger average particle diameters and surface roughness, and higher crystallinity.
Originality/value
Theoretical value: the effects of polyester substrate structures on the morphology and interfacial bonding properties of Cu thin films have rarely been reported.
Keywords
Acknowledgements
This work was financially supported by the Industry-Academia-Research project of Jiangsu Province (BY2016065-51, BY2016065-28), the Textile Industry Association guidance project of China (Nos 2014052, 2016044), the Yancheng Agricultural Science and guiding projects (No. YKN2015011) and the college students’ innovative entrepreneurial training projects of jiangsu province (2016074).
Citation
Huang, X., Meng, L., Wei, Q., Wang, Q. and Zhang, H. (2017), "Effect of substrate structures on the morphology and interfacial bonding properties of copper films sputtered on polyester fabrics", International Journal of Clothing Science and Technology, Vol. 29 No. 1, pp. 39-46. https://doi.org/10.1108/IJCST-09-2015-0101
Publisher
:Emerald Publishing Limited
Copyright © 2017, Emerald Publishing Limited