Natural convection with water-copper nanofluid around a finned vertical cylindrical electronic component
International Journal of Numerical Methods for Heat & Fluid Flow
ISSN: 0961-5539
Article publication date: 18 August 2021
Issue publication date: 20 January 2022
Abstract
Purpose
The purpose of this study is to quantify the free convective heat transfer around a vertical cylindrical electronic component equipped with vertical fins representing an antenna, contained in a closed cavity maintained isothermal. Its cooling is provided via a water-based copper nanofluid whose volume fraction varies between 0% and 10%. Its effective viscosity and thermal conductivity are determined with the Brinkman and Maxwell models.
Design/methodology/approach
The governing equation system has been solved by means of the volume control method based on the SIMPLE algorithm.
Findings
A Nusselt-Rayleigh correlation valid in the 3.32 × 105 – 6.74 × 107 Rayleigh number range is proposed. It allows the thermal sizing of the considered system used in high power electronics to ensure their correct operation in the worst conditions.
Originality/value
The proposed correlations are original and unpublished.
Keywords
Acknowledgements
A. Velazquez has been funded by the Spanish Ministry of Economy and Competitiveness (Ministerio de Ciencia e Innovacion) under research contract PID2019-109619GB-C21.
Citation
Baïri, A. and Velazquez, A. (2022), "Natural convection with water-copper nanofluid around a finned vertical cylindrical electronic component", International Journal of Numerical Methods for Heat & Fluid Flow, Vol. 32 No. 3, pp. 931-943. https://doi.org/10.1108/HFF-03-2021-0158
Publisher
:Emerald Publishing Limited
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