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Natural convection with water-copper nanofluid around a finned vertical cylindrical electronic component

A. Baïri (Laboratoire Thermique Interfaces Environnement (LTIE), Université de Paris, Ville d’Avray, France)
A. Velazquez (Fluid Mechanics and Aerospace Propulsion Department, Universidad Politécnica de Madrid, Madrid, Spain)

International Journal of Numerical Methods for Heat & Fluid Flow

ISSN: 0961-5539

Article publication date: 18 August 2021

Issue publication date: 20 January 2022

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Abstract

Purpose

The purpose of this study is to quantify the free convective heat transfer around a vertical cylindrical electronic component equipped with vertical fins representing an antenna, contained in a closed cavity maintained isothermal. Its cooling is provided via a water-based copper nanofluid whose volume fraction varies between 0% and 10%. Its effective viscosity and thermal conductivity are determined with the Brinkman and Maxwell models.

Design/methodology/approach

The governing equation system has been solved by means of the volume control method based on the SIMPLE algorithm.

Findings

A Nusselt-Rayleigh correlation valid in the 3.32 × 105 – 6.74 × 107 Rayleigh number range is proposed. It allows the thermal sizing of the considered system used in high power electronics to ensure their correct operation in the worst conditions.

Originality/value

The proposed correlations are original and unpublished.

Keywords

Acknowledgements

A. Velazquez has been funded by the Spanish Ministry of Economy and Competitiveness (Ministerio de Ciencia e Innovacion) under research contract PID2019-109619GB-C21.

Citation

Baïri, A. and Velazquez, A. (2022), "Natural convection with water-copper nanofluid around a finned vertical cylindrical electronic component", International Journal of Numerical Methods for Heat & Fluid Flow, Vol. 32 No. 3, pp. 931-943. https://doi.org/10.1108/HFF-03-2021-0158

Publisher

:

Emerald Publishing Limited

Copyright © 2021, Emerald Publishing Limited

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