Orbotech introduces Paragon™-Xpress 50 laser direct imaging system for fine line HDI, flex and rigid-flex mass production

Circuit World

ISSN: 0305-6120

Article publication date: 18 November 2013

293

Citation

(2013), "Orbotech introduces Paragon™-Xpress 50 laser direct imaging system for fine line HDI, flex and rigid-flex mass production", Circuit World, Vol. 39 No. 4. https://doi.org/10.1108/CW.21739daa.010

Publisher

:

Emerald Group Publishing Limited


Orbotech introduces Paragon™-Xpress 50 laser direct imaging system for fine line HDI, flex and rigid-flex mass production

Article Type: New products From: Circuit World, Volume 39, Issue 4

Orbotech Ltd, a leading global provider of yield-enhancing and production solutions for printed circuit boards (PCBs) and IC substrates, today announced the introduction of its new Paragon™- Xpress 50 laser direct imaging (LDI) system for mass production digital imaging of fine line HDI, flex and rigid-flex applications.

“This new model builds upon the proven success of our existing Paragon™-Xpress system. With breakthrough capabilities never before achieved in a mass production LDI tool, Paragon™-Xpress 50 features cutting-edge optics and electronics that enable fine line accuracy at high speed”, said Mr Richard Klapholz, Corporate Executive Vice President for Electronics Business at Orbotech Ltd “For our customers manufacturing high-end PCBs, this level of imaging performance is a critical production solution for keeping pace with the demanding quality and time-to-market requirements of today’s sophisticated consumer electronic devices”.

Based on Orbotech’s proven Large Scan Optics (LSO) Technology™, Paragon™-Xpress 50 is designed, in a typical fully automated dual system line configuration, to achieve high throughput of up to 5,000 panels per day, high depth-of-focus to accurately image uneven surfaces, and high resolution for lines/spaces down to 15 μm so as to enable improved yields and productivity on the most advanced PCBs.

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