Influence of the area of a thermal pad on optical and thermal parameters of LED modules
ISSN: 0305-6120
Article publication date: 5 March 2020
Issue publication date: 7 April 2020
Abstract
Purpose
The purpose of this paper is to present and discuss the results of measurements illustrating influence of the area of a thermal pad and the kind of the used base on thermal and optical parameters of LED modules.
Design/methodology/approach
LED modules including six power LEDs are designed. In the layout of these modules, different areas of a thermal pad of each LED are used. These modules are made using the classical FR-4 base and metal core printed circuit board (MCPCB). Thermal and optical parameters of all the tested modules are measured using the method elaborated by the authors.
Findings
The obtained results of measurements prove that increasing the area of a thermal pad causes a decrease in thermal resistance of the tested LED modules and an increase in power density of the emitted light. The role of the area of a thermal pad is more important for the classical FR-4 base than for MCPCB.
Research limitations/implications
Investigations were performed for only two values of the area of thermal pads and selected values of LEDs forward current.
Originality/value
The presented results of investigations show how the used layout and type of the used base of these modules influence optical and thermal parameters of LED modules. Changing the base of a module can cause even a double decrease in thermal resistance and a double increase in power density of the emitted light.
Keywords
Acknowledgements
The project was financed within the framework of the program by Ministry of Science and Higher Education called “Regionalna Inicjatywa Doskonałości” in the years 2019-2022, project number 006/RID/2018/19, and the sum of financing was 11,870,000 PLN.
Citation
Górecki, K. and Ptak, P.P. (2020), "Influence of the area of a thermal pad on optical and thermal parameters of LED modules", Circuit World, Vol. 46 No. 2, pp. 65-70. https://doi.org/10.1108/CW-11-2019-0174
Publisher
:Emerald Publishing Limited
Copyright © 2020, Emerald Publishing Limited