High quality factor fractal inductor with complementary split-ring array inclusion

Abstract

Purpose

This paper aims to present an efficient method to improve quality factor of printed fractal inductors based on electromagnetic band-gap (EBG) surface.

Design/methodology/approach

Hilbert fractal inductor is designed and simulated using high-frequency structural simulator. To improve the quality factor, an EBG surface underneath the inductor is incorporated without any degradation in inductance value.

Findings

The proposed inductor and Q factor are measured based on well-known three-dimensional simulator, and the results are compared experimentally.

Practical implications

The proposed method was able to significantly decrease the noise with increase in the speed of radio frequency and sensor-integrated circuit design.

Originality/value

Fractal inductor is designed and simulated with and without EBG surfaces. The measurement of printed circuit board prototypes demonstrates that the inclusion of split-ring array as EBG surface increases the quality factor by 90 per cent over standard fractal inductor of the same dimensions with a small degradation in inductance value and is capable of operating up to 2.4 GHz frequency range.

Citation

Padavala, A.K., Akondi, N.K. and Nistala, B.R. (2020), "High quality factor fractal inductor with complementary split-ring array inclusion", Circuit World, Vol. 46 No. 3, pp. 215-219. https://doi.org/10.1108/CW-06-2019-0052